Week 2: 3D Modeling, Circuit Design, and Component Soldering

Smart Obstacle Avoidance Helmet Development Log - Week 2: 3D Modeling, Circuit Design, and Component Soldering

3D Modeling

For the helmet design, we took inspiration from the most handsome team member’s head dimensions to ensure a stylish yet comfortable fit.



We adopted a segmented design to minimize 3D printing curvature, optimize manufacturability, and reduce material strength requirements. Key design considerations include:

  • Segmented Structure: Reducing curvature allows for easier machine production, lowers material strength dependency, and minimizes the need for support structures. Bonus: it also makes the helmet easier to store and travel with.

  • Interlocking Mechanism: Using triangular slots and inserts, reinforced with curved ridges, to enhance helmet stability and prevent lateral movement.



  • Ventilated Design: Ensures breathability and comfort while also reducing material consumption for a more eco-friendly approach. 


  • Dedicated Hardware Compartment: A specialized compartment at the rear of the helmet to house electronic components, ensuring their stability and protection from external interference.

  • Ergonomic Fit: Customizable for different users to maximize adaptability and comfort.

Sensor Placement Strategy:

  • Left forehead, tilted 45° left

  • Right forehead, tilted 45° right

  • Front forehead, straight ahead

  • Front forehead, tilted 50° downward


This configuration enables the helmet to accurately detect surrounding obstacles and assess road slope variations, reducing the risk of accidents due to uneven terrain.

Challenges and Optimization
Initially, we attempted a segmented printing approach to optimize structure and assembly, but it led to stability issues and weak joints, compromising durability. 

The fisrt attempt:

Due to material issues, our initial attempt failed. The black matte filament was highly sensitive to temperature fluctuations, cooling too quickly and causing nozzle clogs. To resolve this, we switched to a more stable material and refined the design for better compatibility and performance.

The second attempt:

The second attempt also failed. Although we switched to glossy white filament, significant thermal shrinkage persisted. Extended printing times, combined with large day-night temperature fluctuations and an open printing environment, led to instability. The printer’s limited resistance to external interference further impacted the process, prompting us to seek external processing solutions.

After multiple failures, we revised the design and ultimately opted for a one-piece print, ensuring better structural integrity and successful fabrication with a higher-quality filament.

The third attempt is underway...

Circuit Design

This is the first design of the circuit:


For prototyping, we opted for a standard 400-hole breadboard, allowing for quick adjustments and easier wire management without the need for PCB fabrication—an essential advantage in early-stage development. The core electronic components include:

  • STM32 microcontroller: Manages sensor data processing and system control.

  • ToF400C laser distance sensor: Ensures high-precision distance measurements.

  • Power Supply: Rechargeable lithium battery for sustained operation.

  • Feedback System: Buzzers and a voice module for clear and intuitive alerts.

Component Soldering

We used manual soldering for assembling the circuitry. However, initial tests revealed unstable connections with the DuPont wires, leading to intermittent contact issues. To resolve this:

  • Wire Trimming: We used a flush cutter to refine the wire ends, improving connectivity.

  • Stabilization Measures: Applied electrical tape to secure loose connections and prevent shifting.

Conclusion

This week, we focused on 3D modeling, circuit design, and soldering, tackling challenges like material weaknesses and connection stability. With these optimizations in place, we are now gearing up for software development and distance measurement testing to ensure precise, real-time obstacle detection. Stay tuned for the next phase!

评论

发表评论

此博客中的热门博文

Week 3: Circuit and PCB Design, Software Development and Distance Measurement Testing

图片
Smart Obstacle Avoidance Helmet Development Log - Week 3:  Circuit and PCB Design,   Software Development and Distance Measurement Testing Finalized Circuit and PCB Design We designed the  final circuit diagram , integrating all components efficiently. Final Circuit Diagram [Circuit Diagram] Final  PCB  Design We developed a   PCB layout   to optimize   electrical connections   and minimize interference. [PCB  Design] Software Development Process This week, we focused on software development and testing for the STM32 + ToF400C distance measurement system , aiming to implement parallel operation for three ToF sensors to ensure synchronized and stable measurements. The development process is outlined below: 1. Single ToF Sensor Testing (Baseline Development) Before implementing a multi-sensor setup, we first tested a single ToF400C sensor using STM32 and Keil uVision : Clock Synchronization : Configured STM32's clock and pins to ensure co...
阅读全文

Week 1: Project Motivation and Design Approach

图片
Smart Obstacle Avoidance Helmet Development Log -  Week 1: Project Motivation and Design Approach Project Background and Motivation In daily life, visually impaired individuals often face risks of injury due to obstacles, while safety concerns are also prominent in industrial environments and cycling scenarios. Traditional guiding canes, although effective, have limitations in complex environments, especially in detecting high-level obstacles such as hanging objects, tree branches, and signboards, as well as sudden unexpected obstructions. To address these challenges, we propose the development of a smart obstacle-avoidance helmet that enhances obstacle detection capabilities for visually impaired individuals and people navigating complex work or daily environments. Our inspiration comes from automotive radar technologies used in autonomous driving systems, such as Tesla’s Autopilot and Baidu Apollo. These systems leverage multiple sensors and intelligent algorithms to perceive the...
阅读全文

Week 4: Finished Product Assembly and Final Testing

图片
Smart Obstacle Avoidance Helmet - Week 4:  Finished Product Assembly and Final Testing Final Assembly and Hardware Integration This week marked a crucial milestone as we finalized the hardware integration and assembly of the Smart Obstacle Avoidance Helmet. After multiple 3D printing failures , we opted for external processing services to ensure a high-quality print with improved material durability. 3D Printed Model Assembly We received the externally printed helmet components and confirmed their structural integrity. The headgear frame was carefully assembled to ensure secure positioning for the ToF sensors . Additionally, we finalized the outer shell design , focusing on a sleek, lightweight, and robust structure that enhances both functionality and comfort. Final Product Showcase Below is the final assembled version of our Smart Obstacle Avoidance Helmet : [Final Product] Component Installation and Wiring To complete the assembly, we: Mounted the STM32 microcontroller and ...
阅读全文